每經訊，據啟(qi)信(xin)寶，新(xin)三板創新(xin)層公(gong)司華成(cheng)工(gong)控（873553）新(xin)增(zeng)專利(li)(li)(li)信(xin)息(xi)，專利(li)(li)(li)權人(ren)(ren)為(wei)(wei)華成(cheng)工(gong)控，發明人(ren)(ren)是萬小(xiao)兵、袁永超(chao)、李超(chao)、程國醒、石建(jian)軍、冷麗。專利(li)(li)(li)授權日為(wei)(wei)2023年6月23日，專利(li)(li)(li)名稱為(wei)(wei)“一種低成(cheng)本伺服驅動器大電流PCB布線結構”，專利(li)(li)(li)類型(xing)為(wei)(wei)中(zhong)國實用新(xin)型(xing)專利(li)(li)(li)，專利(li)(li)(li)申請號為(wei)(wei)CN202222637986.6。

該專利摘要顯(xian)示：本(ben)(ben)申(shen)請提出一(yi)種低成(cheng)本(ben)(ben)伺(si)服驅動(dong)器大(da)電(dian)(dian)(dian)流PCB布(bu)線(xian)(xian)(xian)結構(gou)，包括功(gong)率板以及(ji)(ji)(ji)(ji)散(san)熱片(pian)；功(gong)率板包括依次層(ceng)(ceng)(ceng)疊(die)(die)(die)(die)設(she)(she)置(zhi)(zhi)的(de)第(di)(di)(di)一(yi)疊(die)(die)(die)(die)層(ceng)(ceng)(ceng)、第(di)(di)(di)二(er)疊(die)(die)(die)(die)層(ceng)(ceng)(ceng)、第(di)(di)(di)三(san)疊(die)(die)(die)(die)層(ceng)(ceng)(ceng)以及(ji)(ji)(ji)(ji)第(di)(di)(di)四疊(die)(die)(die)(die)層(ceng)(ceng)(ceng)；所(suo)(suo)述第(di)(di)(di)一(yi)疊(die)(die)(die)(die)層(ceng)(ceng)(ceng)、所(suo)(suo)述第(di)(di)(di)二(er)疊(die)(die)(die)(die)層(ceng)(ceng)(ceng)、所(suo)(suo)述第(di)(di)(di)三(san)疊(die)(die)(die)(die)層(ceng)(ceng)(ceng)以及(ji)(ji)(ji)(ji)所(suo)(suo)述第(di)(di)(di)四疊(die)(die)(die)(die)層(ceng)(ceng)(ceng)上(shang)均(jun)設(she)(she)置(zhi)(zhi)有(you)三(san)相(xiang)電(dian)(dian)(dian)源(yuan)(yuan)(yuan)過(guo)孔(kong)、正向電(dian)(dian)(dian)源(yuan)(yuan)(yuan)過(guo)孔(kong)以及(ji)(ji)(ji)(ji)負(fu)(fu)向電(dian)(dian)(dian)流過(guo)孔(kong)；所(suo)(suo)述第(di)(di)(di)一(yi)疊(die)(die)(die)(die)層(ceng)(ceng)(ceng)上(shang)設(she)(she)置(zhi)(zhi)有(you)所(suo)(suo)述驅動(dong)電(dian)(dian)(dian)路(lu)、所(suo)(suo)述采樣電(dian)(dian)(dian)路(lu)以及(ji)(ji)(ji)(ji)第(di)(di)(di)一(yi)正向電(dian)(dian)(dian)源(yuan)(yuan)(yuan)接(jie)(jie)口(kou)鋪銅(tong)區(qu)；所(suo)(suo)述第(di)(di)(di)二(er)疊(die)(die)(die)(die)層(ceng)(ceng)(ceng)上(shang)設(she)(she)置(zhi)(zhi)有(you)第(di)(di)(di)一(yi)負(fu)(fu)向電(dian)(dian)(dian)源(yuan)(yuan)(yuan)接(jie)(jie)口(kou)鋪銅(tong)區(qu)以及(ji)(ji)(ji)(ji)電(dian)(dian)(dian)子器件的(de)連接(jie)(jie)線(xian)(xian)(xian)；所(suo)(suo)述第(di)(di)(di)三(san)疊(die)(die)(die)(die)層(ceng)(ceng)(ceng)上(shang)設(she)(she)置(zhi)(zhi)有(you)第(di)(di)(di)二(er)正向電(dian)(dian)(dian)源(yuan)(yuan)(yuan)接(jie)(jie)口(kou)鋪銅(tong)區(qu)以及(ji)(ji)(ji)(ji)電(dian)(dian)(dian)源(yuan)(yuan)(yuan)接(jie)(jie)口(kou)連接(jie)(jie)線(xian)(xian)(xian)；所(suo)(suo)述第(di)(di)(di)四疊(die)(die)(die)(die)層(ceng)(ceng)(ceng)上(shang)設(she)(she)置(zhi)(zhi)有(you)三(san)相(xiang)電(dian)(dian)(dian)源(yuan)(yuan)(yuan)接(jie)(jie)口(kou)鋪銅(tong)區(qu)以及(ji)(ji)(ji)(ji)第(di)(di)(di)二(er)負(fu)(fu)向電(dian)(dian)(dian)流接(jie)(jie)口(kou)鋪銅(tong)區(qu)；所(suo)(suo)述散(san)熱片(pian)與(yu)所(suo)(suo)述功(gong)率板間隔第(di)(di)(di)一(yi)預設(she)(she)距離設(she)(she)置(zhi)(zhi)。本(ben)(ben)實(shi)用(yong)新型(xing)的(de)低成(cheng)本(ben)(ben)伺(si)服驅動(dong)器大(da)電(dian)(dian)(dian)流PCB布(bu)線(xian)(xian)(xian)結構(gou)能解決(jue)現有(you)伺(si)服驅動(dong)器大(da)電(dian)(dian)(dian)流PCB布(bu)線(xian)(xian)(xian)成(cheng)本(ben)(ben)較高的(de)問(wen)題(ti)。

(記者 曾健輝)

免(mian)責聲明：本文內容(rong)與數據僅供(gong)參考，不構成投(tou)資建議，使(shi)用前核實。據此操(cao)作，風險(xian)自擔。