TCL中環公(gong)告，為(wei)保(bao)障公(gong)司太(tai)陽(yang)能(neng)級(ji)多(duo)晶硅(gui)料(liao)的穩定供(gong)(gong)應(ying)，公(gong)司子(zi)公(gong)司天(tian)津環睿電子(zi)科技有(you)(you)限公(gong)司、天(tian)津環睿科技有(you)(you)限公(gong)司（統稱“天(tian)津環睿”）近日與(yu)某(mou)供(gong)(gong)應(ying)商簽訂《硅(gui)料(liao)采(cai)(cai)購(gou)框架合(he)同》，合(he)同約(yue)定2023年-2028年天(tian)津環睿預計共向某(mou)供(gong)(gong)應(ying)商及其子(zi)公(gong)司采(cai)(cai)購(gou)43.20萬噸太(tai)陽(yang)能(neng)級(ji)原(yuan)生多(duo)晶硅(gui)，合(he)同交(jiao)易總額(e)以最終成交(jiao)金額(e)為(wei)準。